Influence of plasma treatment duration on the shear strength of transparent epoxy-bonded glass joints at elevated temperatures: a study using Diffuse Coplanar Surface Barrier Discharge

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Authors

BOUTAR Yasmina BRODŇANSKÝ Dávid ELIÁŠOVÁ Martina SOKOL Zdeněk ŠRÁMKOVÁ Petra KELAR TUČEKOVÁ Zlata KELAR Jakub ČERNÁK Mirko

Year of publication 2025
Type Article in Periodical
Magazine / Source Journal of Adhesion
MU Faculty or unit

Faculty of Science

Citation
web https://www.tandfonline.com/doi/full/10.1080/00218464.2025.2572990
Doi https://doi.org/10.1080/00218464.2025.2572990
Keywords DCSBD; epoxy adhesive; Low-iron glass; plasma treatment; shear strength; surface modification; thermal effects
Description Plasma treatment is increasingly used to enhance surface properties in adhesion-dependent applications. However, its effects on epoxy-bonded glass under elevated temperatures remain unexplored. Hence, this research investigates the impact of Diffuse Coplanar Surface Barrier Discharge (DCSBD) plasma treatment duration on the shear strength of epoxy-bonded low-iron glass. Experiments were conducted on glass samples plasma-treated on the tin and air sides for 5, 15, 30, and 60 s, and on untreated references. Specimens were bonded using the epoxy adhesive LOCTITE® EA 9455 and tested under block shear conditions at room temperature (RT), 40°C, and 80°C. The 30 s treatment yielded the highest shear strength at RT, indicating optimal surface activation. Shorter treatments (5–15 s) and prolonged exposure (60 s) did not enhance adhesion compared to the reference, indicating that both insufficient and excessive plasma exposure can lead to suboptimal bonding. At elevated temperatures, the shear strength decreased for all conditions, consistent with adhesive softening above the glass transition temperature (Tg). These findings highlight the importance of optimising plasma exposure time to balance surface activation with thermal durability. They emphasise additionally the need for further investigation into plasma-induced surface modifications and their stability in bonded assemblies for demanding environments.
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